The AVP, a size, weight, and power (SWaP) optimized advanced video processor, provides best-in-class artificial intelligence performance for thermal infrared and visible camera perception systems. It incorporates the latest Qualcomm® QCS8550, the industry’s most advanced mobile processor system on chip (SoC) featuring up to 48 TOPS inference compute performance. The QCS8550 is part of Qualcomm’s Product Longevity Program, ensuring future-proof product stability.
The AVP is designed to efficiently run Teledyne FLIR Prism AI software providing detection, classification, and target tracking and Prism ISP algorithms including super resolution, image fusion, atmospheric turbulence removal, electronic stabilization, local-contrast enhancement, and noise reduction. Prism software runs efficiently on the AVP leveraging the available system on module (SoM) functions to provide critical edge AI capabilities for automotive, airborne, unmanned, counter-UAS (CUAS), perimeter security, and intelligence, surveillance, and reconnaissance (ISR) applications.
- Prodotti
- Telecamere, componenti e laser OEM
- Kit di sviluppo software (SDK)
- FLIR AVP
Aggiunto al carrello
Modello:
Il tuo ordine è idoneo per la spedizione gratuita entro 2 giorni e per i resi facili
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Industry-Leading Size, Weight, and Power (SWaP) Consumption
Run Prism AI and ISP on the highest-performance QCS8550 SoC in the industry
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FUTURE PROOF YOUR DESIGN
Flexible hardware is part of the Qualcomm Product Longevity Program
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BUILT FOR INTEGRATORS
Simplify development and reduce risk with Prism software and support
Presentazione di Prism AI
MTI e rilevamento oggetti
Classificatore a grana fine
Rilevamento di oggetti aria-terra
Specifiche
Generali
- Codice prodotto
- SOM 4251537
Devkit Part Number: 421-0100-00
- Memoria
- 16GB LPDDR5x
- Processore
- Qualcomm QCS8550
64-bit Octa-Core
Application processor at 3.2 GHz (Gold+), 2.8GHz (4 x Gold), 2.0GHz (3 x Silver) Qualcomm Kryo CPU
Qualcomm Adreno GPU 740
Qualcomm Hexagon Tensor Processor (HTP) with Hexagon Vector eXtensions (HVX) and Hexagon Matrix eXtensions (HMX)
Qualcomm Secure Processing Unit for advanced secure use cases
Low Power AI (LPAI) subsystem with dedicated DSP and AI accelerator (eNPU) supporting always-on audio, sensors, contextual data streams, and Always-on camera.
Comunicazione e Memorizzazione dati
- Video
- UHD video processing unit
AV1 decode
Native decode support for H.265 Main 10, H.265 Main, H.264 High, and VP9 profile 2
Native encode support for H.265 Main 10, H.265 Main, H.264 high formats
Meccanico
- Dimensioni
- SOM Board: 40.27 x 33.41 mm LGA form factor
- Peso
- 5 grams (without shield)
Other
- Operating Environment [OE]
- Input Voltage: 3.6V Operating Temperature: -20 to +60 °C
- Operating System [OS]
- OS - Linux LE (r76)
Stoccaggio
- Memorizzazione
- 256GB UFS 3.1
Prodotti correlati
Documenti correlati
Restrizioni all'esportazione
Restrizioni all'esportazione
Le informazioni contenute in questa pagina si riferiscono ai prodotti che possono essere soggetti al Regolamento sul traffico internazionale di armi (International Traffic in Arms Regulations, ITAR) (22 C.F.R. Sezioni 120-130) o al Regolamento sull’amministrazione delle esportazioni (Export Administration Regulations, EAR) (15 C.F.R. Sezioni 730-774) a seconda delle specifiche del prodotto finale; la giurisdizione e la classificazione saranno fornite su richiesta.
